Electrical Engineer - Microelectronics Advanced Packaging
Palm Bay, Florida
Job ID 23736L3Harris is dedicated to recruiting and developing high-performing talent who are passionate about what they do. Our employees are unified in a shared dedication to our customers’ mission and quest for professional growth. L3Harris provides an inclusive, engaging environment designed to empower employees and promote work-life success. Fundamental to our culture is an unwavering focus on values, dedication to our communities, and commitment to excellence in everything we do.
L3Harris Technologies is the Trusted Disruptor in the defense industry. With customers’ mission-critical needs always in mind, our employees deliver end-to-end technology solutions connecting the space, air, land, sea and cyber domains in the interest of national security.
Job Title: Senior Specialist, Advanced Packaging Integration
Job Code: 23736
Job Location: Palm Bay, FL
Job Schedule: 9/80 (Every other Friday off!)
Relocation: Relocation assistance may be available to qualified applicants
Job Description:
This position is responsible for the development and execution of advanced packaging assembly processes including hybrid and thermocompression bonding. The lead will plan pathfinding experiments and Design of Experiments (DOEs) to generate process and tool knowledge for chip-to-wafer and wafer-to-wafer stacking. This role will necessitate strategic planning working across industry to identify partners, tools, and technologies to develop advanced packaging solutions for high density interconnects. Expertise gained in this position will provide technical insight for our existing technologies and develop new technologies to capture and lead new programs with our military, government, and commercial customers.
We look forward to reviewing your application!
Essential Functions:
- Lead DOEs and data analysis to create process technology.
- Collaborate with development and manufacturing to define needs for key process technology requirements.
- Engage external vendors and research leaders.
- Perform quantitative problem solving and drive solutions using risk management
- Lead trades to evaluate technology integration strategies, process and metrology tools, and IP technology transfers.
- Domestic and international travel
Qualifications:
- Bachelor’s Degree in Materials Science, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Chemistry, Physics, or related field and a minimum of 6 years of prior relevant experience or Graduate Degree and a minimum of 4 years of prior related experience.In lieu of a degree, minimum of 10 years of prior related experience.
- 3+ years’ experience in semiconductor process engineering with die attach, chip to wafer, or wafer to wafer bonding
- Ability to obtain a TS/SCI security clearance
- Ability for both domestic and international long term field assignments
Preferred Additional Skills:
- Prior integration experience of 3D packaging using through silicon vias, temporary bonding/debonding, wafer thinning, microbumping, and hybrid bonding is preferred.
L3Harris Technologies is proud to be an Equal Opportunity Employer. L3Harris is committed to treating all employees and applicants for employment with respect and dignity and maintaining a workplace that is free from unlawful discrimination. All applicants will be considered for employment without regard to race, color, religion, age, national origin, ancestry, ethnicity, gender (including pregnancy, childbirth, breastfeeding or other related medical conditions), gender identity, gender expression, sexual orientation, marital status, veteran status, disability, genetic information, citizenship status, characteristic or membership in any other group protected by federal, state or local laws. L3Harris maintains a drug-free workplace and performs pre-employment substance abuse testing and background checks, where permitted by law.
Please be aware many of our positions require the ability to obtain a security clearance. Security clearances may only be granted to U.S. citizens. In addition, applicants who accept a conditional offer of employment may be subject to government security investigation(s) and must meet eligibility requirements for access to classified information.
By submitting your resume for this position, you understand and agree that L3Harris Technologies may share your resume, as well as any other related personal information or documentation you provide, with its subsidiaries and affiliated companies for the purpose of considering you for other available positions.
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