Job Title: Printed Circuit Board Subject Matter Expert (1st shift) (9/80)

Job Code: 20170

Job Location: Palm Bay, FL

Job Description:

The person filling this position will support cross-functional team, supporting the design and review of Printed-Circuit-Boards designs prior to release to the board shop house.  Will directly interface with a broad range of Electrical, Mechanical, Manufacturing engineering disciplines, during the design, fabrication and production floor activities.  Responsibilities will include, design review meetings, not limited to drawings, artwork reviews, attending design and status meetings, peer reviews, and production support.  Should also have good understanding of complex HDI designs lamination and micro-via structures. The role will require of some travel time as well, auditing board shops that manufacture product that will be used within L3Harris products.

Essential Functions:

• The engineer will work closely with a cross-functional team to ensure hardware producibility and manufacturability build strategies.
• Attend, participate and support design review meetings in detailed engineering design reviews as required. 
• Provides advanced technical support thru design phase and related to processes of manufacturing activities of the PCB.
• Identify critical-to-yield process parameters and specifications throughout the design review prior to drawing release and downstream manufacture.
• Understanding of Printed Circuit Board manufacturing and design applications.
• Candidate will support teams in the resolution of manufacturing production yields, quality and reliability issues related to PCB matters.
• Must be willing to travel as required to visit and conduct on-site supplier quality audits, assessments and inspections of PCB manufacturer houses.
• Facility Process audit, understand of HDI PCB manufacturing, able to work with and support PCB suppliers in manufacturing and quality issues.

Qualifications:

• Bachelor’s Degree and minimum 9 years of prior relevant experience. Graduate Degree and a minimum of 7 years of prior related experience. In lieu of a degree, minimum of 13 years of prior related experience.

Preferred Additional Skills:

• Working knowledge of IPC/J-STD workmanship requirements. Specifically, IPC-A600, IPC-6012/6013, as well as MIL-Spec-55110 and MIL-Spec-31032.
• Deep knowledge of common PCB electronic packaging details including surface finishes, plating, lamination and stack-up best practices.
• Experience on interconnect conductivity vs thickness and operating frequencies dielectrics choices.
• Knowledge on Micro-Via Processes, able to read micro-sections.
• PCB material finishes and type knowledge is required – specifically pre-preg core different material types.
• Understanding and knowledge of PCB manufacturing processes, common defects, problems, and how those non-conformances impact overall reliability of the product.
• Knowledge of bare PCB manufacture’s capabilities, constraints as well as performance and reliability vs lifecycle cost.
• Hands-on in the manufacturing of electronics for high reliability military and government systems is preferred.
• Knowledge with root cause and corrective action analysis tools manufacturing process problems, workmanship defects, mechanical test failures, etc.
• Excellence with solving problems as they occur, recommending and implementing improvements as needed related to production processes.
• Ability to manage resources and multiple priorities while interacting with individuals at all levels within the organization and customers as required.
• Proficiency in Microsoft Excel, Power Point and Word

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