Job Title: Lead Electrical Engineer, Silicon Substrate

Job Code: 20960

Job Location: Palm Bay, FL

Job Schedule: 9/80 (Every other Friday off!)

Relocation: Relocation assistance may be provided to qualified applicants

Job Description: 

The position is responsible for leading electrical design architecture for silicon substrate based advanced packaging technology. You will work closely with a small-sized design team providing signal integrity analysis to optimize signal routing for emerging high speed advanced packaging structures and continuously improve design rule checks (DRC). At L3Harris, you will engage with both internal and external customers to define architectures and requirements and then flow down to the design team. You will also engage with leads in the packaging integration team and test team to help define electrical test structures to characterize passive microwave circuits for crosstalk, insertion loss, and other parameters. This key role will provide technical insight for our existing technologies and develop new technologies to capture and lead new programs with our military, government, and commercial customers.  

Essential Functions: 

• Define electrical architecture and requirements working with both external and internal customers. 
• Design and layout multilayer structures, lead team to create all necessary design files, and documentation for advanced packaging designs
• Perform signal integrity analysis and finite element modeling (FEM) of passive RF structures using 3D electromagnetic simulation software (HFSS preferred), incorporate analysis results in design structures to optimize performance
• Communicate with process integration team and test team in development runs, provide inputs for electrical test structures to develop architecture
• Communicate status of technical progress through reports, presentations, and/or emails of challenges to both external and internal customers
• Provide technical leadership for design team ranging from 2-10 members
• Obtain a US government Security Clearance (TS/SCI)

Qualifications: 

• Bachelor’s Degree and a minimum of 9 years of prior relevant experience or Graduate Degree and a minimum of 7 years of prior related experience. In lieu of a degree, minimum of 13 years of prior related experience.
• Prior or current professional experience in passive microwave circuits and applications to digital signaling (below 40 GHz) including design and analysis of passive filters, couplers, resonators, and microwave calibration structures
• Experience with small signal electrical measurements using Vector Network Analyzer (VNA) and multiport RF networks
• Analysis software skills including frequency-domain and time-domain circuit modelers (e.g. Advanced Design System) and 3D electromagnetic simulation
• Understanding of MTL Theory (Multiconductor Transmission Lines )

Preferred Additional Skills:

• Existing TS/SCI security clearance preferred
• HFSS preferred
• Knowledgeable in signal integrity analysis for high speed digital designs including sources of coupling and crosstalk (NEXT/FEXT)
• Experience using Cadence Allegro Advanced Package Designer ECAD platform
• Knowledgeable using Cadence Virtuoso (preferred) for silicon layout design flow