Lead Electrical Engineer, Silicon Substrate Design
Palm Bay, Florida
Job ID 20960L3Harris is dedicated to recruiting and developing high-performing talent who are passionate about what they do. Our employees are unified in a shared dedication to our customers’ mission and quest for professional growth. L3Harris provides an inclusive, engaging environment designed to empower employees and promote work-life success. Fundamental to our culture is an unwavering focus on values, dedication to our communities, and commitment to excellence in everything we do.
L3Harris Technologies is the Trusted Disruptor in the defense industry. With customers’ mission-critical needs always in mind, our employees deliver end-to-end technology solutions connecting the space, air, land, sea and cyber domains in the interest of national security.
Job Title: Lead Electrical Engineer, Silicon Substrate
Job Code: 20960
Job Location: Palm Bay, FL
Job Schedule: 9/80 (Every other Friday off!)
Relocation: Relocation assistance may be provided to qualified applicants
Job Description:
The position is responsible for leading electrical design architecture for silicon substrate based advanced packaging technology. You will work closely with a small-sized design team providing signal integrity analysis to optimize signal routing for emerging high speed advanced packaging structures and continuously improve design rule checks (DRC). At L3Harris, you will engage with both internal and external customers to define architectures and requirements and then flow down to the design team. You will also engage with leads in the packaging integration team and test team to help define electrical test structures to characterize passive microwave circuits for crosstalk, insertion loss, and other parameters. This key role will provide technical insight for our existing technologies and develop new technologies to capture and lead new programs with our military, government, and commercial customers.
Essential Functions:
- Define electrical architecture and requirements working with both external and internal customers.
- Design and layout multilayer structures, lead team to create all necessary design files, and documentation for advanced packaging designs
- Perform signal integrity analysis and finite element modeling (FEM) of passive RF structures using 3D electromagnetic simulation software (HFSS preferred), incorporate analysis results in design structures to optimize performance
- Communicate with process integration team and test team in development runs, provide inputs for electrical test structures to develop architecture
- Communicate status of technical progress through reports, presentations, and/or emails of challenges to both external and internal customers
- Provide technical leadership for design team ranging from 2-10 members
- Obtain a US government Security Clearance (TS/SCI)
Qualifications:
- Bachelor’s Degree and a minimum of 9 years of prior relevant experience or Graduate Degree and a minimum of 7 years of prior related experience. In lieu of a degree, minimum of 13 years of prior related experience.
- Prior or current professional experience in passive microwave circuits and applications to digital signaling (below 40 GHz) including design and analysis of passive filters, couplers, resonators, and microwave calibration structures
- Experience with small signal electrical measurements using Vector Network Analyzer (VNA) and multiport RF networks
- Analysis software skills including frequency-domain and time-domain circuit modelers (e.g. Advanced Design System) and 3D electromagnetic simulation
- Understanding of MTL Theory (Multiconductor Transmission Lines )
Preferred Additional Skills:
- Existing TS/SCI security clearance preferred
- HFSS preferred
- Knowledgeable in signal integrity analysis for high speed digital designs including sources of coupling and crosstalk (NEXT/FEXT)
- Experience using Cadence Allegro Advanced Package Designer ECAD platform
- Knowledgeable using Cadence Virtuoso (preferred) for silicon layout design flow
Please be aware many of our positions require the ability to obtain a security clearance. Security clearances may only be granted to U.S. citizens. In addition, applicants who accept a conditional offer of employment may be subject to government security investigation(s) and must meet eligibility requirements for access to classified information. By submitting your resume for this position, you understand and agree that L3Harris Technologies may share your resume, as well as any other related personal information or documentation you provide, with its subsidiaries and affiliated companies for the purpose of considering you for other available positions.
L3Harris Technologies is proud to be an Equal Opportunity Employer. L3Harris is committed to treating all employees and applicants for employment with respect and dignity and maintaining a workplace that is free from unlawful discrimination. All applicants will be considered for employment without regard to race, color, religion, age, national origin, ancestry, ethnicity, gender (including pregnancy, childbirth, breastfeeding or other related medical conditions), gender identity, gender expression, sexual orientation, marital status, veteran status, disability, genetic information, citizenship status, characteristic or membership in any other group protected by federal, state or local laws. L3Harris maintains a drug-free workplace and performs pre-employment substance abuse testing and background checks, where permitted by law.