L3Harris

Job Title: Senior Specialist, Manufacturing Engineer

Job Code: SAS20222811-93921

Job Location: Palm Bay, FL

Job Description:

L3Harris is searching for talented Senior Specialist Manufacturing Engineer that will support manufacturing related activities of ground, avionics, and space development of prototype hardware. The type of hardware produced at this L3Harris location is often complex, containing circuit card assemblies (CCAs), microelectronics assemblies, cable harness and higher-level system assemblies. The person filling this position will directly be involved with prototype hardware for development efforts supporting future technology needs. Candidate fulfilling this role needs to have an In-depth familiarity with all aspects of printed circuit board design, fabrication and manufacturing, as well as cable harness experience..

Essential Functions:

• Interfacing with design, mechanical and electrical engineers to ensure hardware producibility developing build strategies.
• Communicate effectively with internal and external customers.
• Highly interactive, willing to work in team environment
• Be able to successfully read, and understand Engineering Assembly Drawings.
• Generate and updating of Assembly Method Sheets (AMS)/Work Instructions and directing support personnel in the day-to-day execution of manufacturing task.
• Plan and support the build and modification of electronics systems including procurement support, assembly method/work instructions generation, tooling design support, material/process development, facilities/equipment planning, and resolution of manufacturing, quality and reliability issues.
• Support process improvement initiatives of technical and operational nature.
• Design, support and develop manufacturing and engineering tools, strategies and systems.
• Estimate manufacturing costs, determine time standards, and make recommendations for tooling and process requirements of new or existing product lines.
• Support the root cause and corrective action (RCCA) processes

Qualifications:

• Bachelor’s Degree and minimum 6 years of prior relevant experience. Graduate Degree and a minimum of 4 years of prior related experience.
• Strong knowledge of MIL/IPC,J-STD workmanship and performance standards relate to electronic assemblies (Mil-Perf 38534, IPC-610, IPC-620, NASA-STD-8739, J-STD-001,etc.).
• Experience in, Surface Mount Technology (SMT), Circuit Card Assembly, Ruggedization of Circuit Card Assemblies and Higher Level Integration of Circuit Card Assembly.

Preferred Additional Skills:

• Hands-on experience with high reliability electronic assembly processes of circuit card assembly as well as assembly processes for cable harnesses.
• Background and hands-on in the manufacturing of electronics for high reliability military and government systems is preferred.
• Background in developing manufacturing processes and transferring of products and processes to production efforts is highly preferred.
• Excellent communication skills including the ability to deliver effective presentations to peers, management and customer are preferred.
• Working knowledge of IPC/J-STD workmanship requirements.
• Understanding and experience in Control or similar MRP based system, and Aegis based Manufacturing Execution System (MES).
• Familiarity with root cause and corrective action analysis tools for use towards manufacturing process problems, workmanship defects, mechanical test failures, etc.